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Lapping/Polishing Machine
TR06M - Compact Single-sided Laping/Polishing Machine
Description

"I need a simplified machine for sample polishing."
"I want a compact machine due to the limited space to install."

This model was developed based on these demands.

Dimensions of the machine: 305 mm x 220 mm, a compact body.
Power supply: AC100V which is widely equipped

Capable of processing metal, glass, wafers, etc.
Suitable for lapping, polishing and simple CMP by replacing polishing plates.

Not only wet polishing with slurry but also dry polishing using polishing sheets.

* Capable of change in the number of polishing axis and the attachment of pressure cylinder.
(Optional features)

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[ Object Work ]

  • Maximum φ50 mm
  • Glass, plastic, metal, silicon, compound semiconductor, ceramics.
  • plastic
    plastic
    metal
    metal
    Glass
    Glass
    SUS
    SUS
    compound semiconductor
    compound semiconductor
     
    Along the earth... *Energy-saving: Energy consumption down to 1/5, compared with existing machines.
    *Space-saving: Compact desktop with 310 mm height. Easy to operate the machine in a limited space.
    * Low cost: Enables to start R&D schedule quickly.
    Specifications
    * Specifications described below are for a standard model.
    Lapping Plate
    Lapping Plate Diameter Φ150mm
    Lapping Plate Rotational Speed 0 - 80rpm
    Non-step speed
    Work Axle
    maximum 2 axles
    Object Work
    maximum size (circle) around φ50mm
    Machine Weight & Dimensions
    Dimensions (Standard) W 340mm x D 220mm x H 310mm
    Weight 20 kg
    Contact us
    Current time (JAPAN) : 11:19 27/5/2017
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